HoloLens' 24-core chip makes vivid AR possible

The 28-nanometer process "Tensilica" chip, built by TSMC, has 65 million logic gates, 8MB of ultra-fast static RAM (SRAM) and 1GB of DDR3 RAM, all crammed into a 12mm x 12mm (half-inch square) package. It's designed to process input from the inertial chip, environment cameras, depth camera and other sensors. By speeding up calculations 200 times over software alone, it provides ready-to-use position data to the headset's main Intel "Cherry Trail" CPU, freeing it to run apps and games.